Through-hole Passive Components Market Size

Market Outlook:

Through-hole Passive Components Market was over USD 37.98 Billion in 2023 and is expected to surpass USD 74.05 Billion by end of the year 2032, observing around 7.7% CAGR between 2024 and 2032.

• Base Year Value (2023): USD 37.98 Billion
• CAGR (2024-2032): 7.7%
• Forecast Year Value (2032): USD 74.05 Billion
• Historical Data Period: 2019-2023
• Largest Region: Asia Pacific
• Forecast Period: 2024-2032

Market Dynamics:

Growth Drivers & Opportunity:

The increasing demand for electronic components in various sectors such as automotive, consumer electronics, and telecommunications is a significant growth driver for the through-hole passive components market. As these industries continue to expand, the need for passive components like resistors, capacitors, and inductors will also rise, driving market growth.

The growing trend towards miniaturization of electronic devices is another major growth driver for the through-hole passive components market. As consumers demand smaller and more compact electronic products, manufacturers are increasingly incorporating through-hole passive components into their designs to save space without compromising performance.

The emergence of new technologies such as Internet of Things (IoT) and 5G wireless networks is creating new opportunities for the through-hole passive components market. These technologies require a wide range of passive components to enable data transmission, energy storage, and signal processing, driving demand for through-hole components.

Industry

Report Scope

Report Coverage	Details
Segments Covered	Component, Leads Model, Application
Regions Covered	• North America (United States, Canada, Mexico) • Europe (Germany, United Kingdom, France, Italy, Spain, Rest of Europe) • Asia Pacific (China, Japan, South Korea, Singapore, India, Australia, Rest of APAC) • Latin America (Argentina, Brazil, Rest of South America) • Middle East & Africa (GCC, South Africa, Rest of MEA)
Company Profiled	Vishay Intertechnology,, YAGEO Group, Murata Manufacturing, KYOCERA AVX Components, Panasonic Holdings, Bourns,, TDK, TE Connectivity, Microchip Technology

However, despite the strong growth drivers, there are also some restraints impacting the through-hole passive components market. A significant challenge is the availability of alternative technologies like surface mount devices (SMD) which offer advantages in terms of size, weight, and cost. As a result, some manufacturers are opting for SMD components over through-hole components, limiting market growth.

Another major restraint for the through-hole passive components market is the increasing competition from low-cost manufacturers in countries like China and Taiwan. These manufacturers offer passive components at lower prices, putting pressure on established players to reduce their prices and impacting profit margins.